SAMSUNG Develops 12 Megapixel CMOS Imager with 1.12um Back Side Illuminated Pixel Architecture for Highquality Imaging on Premium Feature and Smart Phones

Seoul, Korea - February 10, 2011 : Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today announced its new 12 Megapixel (Mp) CMOS imager using advanced 1.12 micron pixel technology. Based on the back side illuminated (BSI) pixel architecture, the 1/3.2-inch imager offers clear and sharp images in low light environments and is optimized for premium feature and smart phones. 'With extensive experience and technical...
(read more)